Pin Grid Array

Pin Grid Array
Low Prices. Big Selection. Save on pin grid array.
www.become.com

PGA Sockets
Machined Pin Grid Array IC Sockets Available in SMT and Thru-Hole.
www.mill-max.com

Land Grid Array
LGAs are used to enable high performance, separable electrical connections. They provide excellent signal integrity at high frequencies in fine pitch and low profile applications.
www.hcdcorp.com

Adapters-Plus Pin Grid Array
Test sockets for BGA, LGA, QFP, PGA, SOP, Tsop.
www.adapt-plus.com

PGA Sockets and Adapters
Highly reliable sockets and adapters for any development, test or production application. Standard and interstitial pin grid array (PGA) footprints.
www.advanced.com

BGA Expertise
Maxtek, a Tektronix Company, providing the design, assembly and test of high-performance ball grid array packages.
www.maxtek.com

Pin grid array - Wikipedia, the free encyclopedia
The pin grid array at the bottom of a XC68020, a prototype of the Motorola 68020 ... A pin grid array, often abbreviated PGA, refers to the arrangement of pins on ...
en.wikipedia.org

pin grid array: Definition from Answers.com
The pin grid array at the bottom of a XC68020, a prototype of the Motorola 68020 ... The pin grid array or PGA is a type of packaging used for integrated circuits, ...
www.answers.com

Ceramic Pin Grid Array (CPGA)
... Pin Grid Array (CPGA) 44 Pin Ceramic Pin Grid Array, Cavity ... Pin. Grid. Array (CPGA) © 2000 National Semiconductor Corporation. MS101111. www.national.com ...
www.national.com

Pin Grid Array
Pin Grid Array. Interconnect Systems. OST. Interconnect Specialties provides custom Pin. Grid Arrays, available to meet your special ...
www.isiconnectors.com

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microprocessorThe pin grid array or PGA is a type of packaging used for integrated circuits, particularly microprocessors.

PGA On a PGA, the integrated circuit (IC) is mounted in a ceramic slab of which one face is covered, or partially covered, in a square array of metal pins. The pins can then be inserted into the holes in a printed circuit board and soldered in place. They are almost always spaced 2.54 millimeter (a tenth of an inch) apart. For a given number of pins, this type of package occupies less space than older types such as the dual in-line package (DIP).

PGA Variants The plastic pin grid array (PPGA) and later flip-chip pin grid array (FCPGA) versions were both created by Intel Corporation for their Pentium central processing units, and are often used on motherboards with ZIF (Zero Insertion Force) sockets to protect the delicate pins.

PPGA: Plastic pin grid array
FCPGA: flip-chip pin grid array
CPGA: Ceramic pin grid array
OPGA: Organic pin grid array